Wednesday, January 25, 2012

iPhone WiFi Repair: Heat Gun Reflow

In this video I demonstrate how to repair your iPhone wifi with a heat gun. It is an alternate method to reflow (rehot, rework) your fatigued solder joints connecting the wifi chip and components to the printed circuit board (pcb), aka motherboard. The original article and additional feedback on using the heat gun method can be found at www.iphonetiquicia.com Reflowing the iPhone motherboard using an oven is a proven method to repair the iPhone wifi. Here is a list of successes using the oven method: www.iphonetiquicia.com Advantages of the Heat Gun method over the Oven method: 1) Concentrated application of heat only on the problem wifi components. 2) Shorter treatment time. 3) Ability to use lead-free solder to gauge treatment period. Despite the fact that the oven method works, it carries the risk of damaging your entire motherboard because oven temperatures can be difficult to control. On the other hand, a heat gun will allow you to concentrate the heat on the location of the wifi chip connections without applying heat to the other board components. This method will work with the iPhone 2G, 3G, 3GS. In fact, it will work with the iPhone 4 when those phones accumulate solder fatigue over time and begin to fail. The 2G is a little more difficult to rework than the 3G and 3GS because the motherboard is connected with solder rather than a push-in connector. In addition, this method will also repair the iPod Touch or any other unit that fails due to fatigued solder joints ...

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